The Electronics Cooling module has been developed to address thermal management challenges in electronic systems. It includes dedicated electronic component libraries and advanced models for fans, heat pipes, Peltier modules, and multilayer printed circuit boards (PCBs).

With this module, engineers can accurately simulate the cooling performance of electronic devices, predict temperature distribution, and identify potential hotspots that could compromise product reliability and performance. The module also supports Joule heating calculations, enabling a comprehensive evaluation of the thermal behavior of electronic systems.

The EDA Bridge module enables the direct import of data from leading electronic design automation software and automatically converts it into 3D models ready for CFD simulation.

It supports standard formats such as ODB++, IPC-2581, IDF, and other industry formats, allowing engineers to reconstruct PCB geometry and automatically assign materials, thermal properties, and dissipated power values. This approach significantly reduces simulation model preparation time and improves result accuracy and reliability.

The BCI-ROM module generates Reduced Order Models that are independent of boundary conditions, derived from detailed 3D analyses while preserving the spatial and temporal accuracy of the original model across different thermal environments.

BCI-ROM technology enables extremely fast transient simulations for complex power profiles and extended mission profiles, with export capabilities to matrices, SPICE subcircuits, VHDL-AMS, and FMU formats for standalone, circuit-level, or system-level analyses.

The Package Creator module enables the creation of detailed thermal models of electronic packages within minutes, based on clean 3D CAD geometry through a guided workflow with templates for the main package families.

It provides customizable default values, an extensible material library, adjustable levels of detail for dies and interconnects, PCB generation capabilities, and automatic calibration against measurement data to improve junction temperature prediction accuracy.

The T3STER Automatic Calibration module for Simcenter FLOEFD automatically calibrates CAD-integrated CFD thermal models by comparing the simulated Structure Function with the one obtained from T3STER transient measurements, aligning the thermal behavior of the model with experimental test data.

It automates the exploration of package internal dimensions and material properties, reducing manual calibration time and generating detailed, accurate, and reliable 3D models for transient analyses, electronics cooling studies, and reliability assessments.

The Power Electrification module has been developed for the simulation of batteries and electrified systems. It enables accurate modeling of the electro-thermal behavior of cells and prediction of heat dissipation during charging and discharging cycles.

The module includes both equivalent circuit models and coupled electrochemical models, allowing engineers to predict state of charge, voltage, current, and temperature distribution within the battery. This capability is essential for the development of electric vehicles, energy storage systems, and power electronics applications.

Thanks to CAD-integrated simulation, designers can optimize battery cooling systems from the earliest stages of the development process.

The Structural module introduces FEA capabilities directly within the Simcenter FLOEFD environment. It enables linear static and modal analyses using the same models already employed for CFD simulations.

One of the key advantages of the module is the ability to directly use temperature and pressure fields calculated from the fluid dynamics simulation as structural loads. This makes it easier to study the interaction between fluid dynamics, thermal, and mechanical phenomena without transferring data between different software environments.

For more advanced applications, models can be exported to Simcenter Nastran and Simcenter 3D for further structural investigations.

The Electromagnetic (EMAG) module extends the multiphysics capabilities of Simcenter FLOEFD by introducing low-frequency electromagnetic simulation. It enables the evaluation of phenomena such as ohmic losses, core losses, skin effect, and proximity effect, which directly influence heat generation in electrical components.

The electromagnetic analysis is performed through co-simulation with CFD, enabling continuous data exchange between the thermal and electromagnetic fields. This approach provides a realistic representation of the behavior of transformers, electric motors, busbars, inductors, and induction heating systems.

Thanks to integrated multiphysics simulation, engineers can predict operating temperatures more accurately and optimize the cooling strategy of electrical components.